Wafer-Level Automotive IC Packaging
Budget: ₹12,500 – ₹37,500 INR
I need a complete wafer-level packaging approach tailored for an automotive electronics device where high reliability is the overriding priority. The goal is to move from concept to a production-ready package that can withstand the thermal and mechanical stresses found under-the-hood and meet typical automotive qualification standards such as AEC-Q100.
Scope of work
• Evaluate the die’s electrical, thermal, and mechanical needs and translate them into a wafer-level package stack-up, material set, and process flow.
• Model key stress points and propose design tweaks or material changes that maximise reliability; maintaining a compact outline or improved heat dissipation would be welcome bonuses if they do not compromise the main reliability target.
• Deliver a clear manufacturing roadmap that covers mask design guidelines, key process parameters, and inline control points.
• Define the reliability test plan, expected pass criteria, and any corner-case risks so that my internal team can align our qualification schedule.
• Provide all drawings, Gerbers/ODB++, and simulation files so we are able to hand them straight to an OSAT for quotation.
Acceptance criteria
• Package concept must be wafer-level, not wire-bond or flip-chip hybrids.
• Design must show calculated or simulated margins that meet or exceed AEC-Q100 Grade 0 thermal cycling and high-temperature operating life expectations.
• Documentation is complete enough for an external fabricator to begin tooling with no open questions.
If you have a proven track record in automotive-grade WLP designs, I would like to review a brief outline of your past projects and the design tools you normally deploy before we proceed.
Scope of work
• Evaluate the die’s electrical, thermal, and mechanical needs and translate them into a wafer-level package stack-up, material set, and process flow.
• Model key stress points and propose design tweaks or material changes that maximise reliability; maintaining a compact outline or improved heat dissipation would be welcome bonuses if they do not compromise the main reliability target.
• Deliver a clear manufacturing roadmap that covers mask design guidelines, key process parameters, and inline control points.
• Define the reliability test plan, expected pass criteria, and any corner-case risks so that my internal team can align our qualification schedule.
• Provide all drawings, Gerbers/ODB++, and simulation files so we are able to hand them straight to an OSAT for quotation.
Acceptance criteria
• Package concept must be wafer-level, not wire-bond or flip-chip hybrids.
• Design must show calculated or simulated margins that meet or exceed AEC-Q100 Grade 0 thermal cycling and high-temperature operating life expectations.
• Documentation is complete enough for an external fabricator to begin tooling with no open questions.
If you have a proven track record in automotive-grade WLP designs, I would like to review a brief outline of your past projects and the design tools you normally deploy before we proceed.