Ultra-High Vacuum Chamber Design and System Cooling
Budget: $50 – $0 USD
We are developing ultra high speed scientific imaging systems requiring a UHV chamber for TEC sensor cooling. This is integrated with our high speed electronics and overall system cooling is required.
Looking for experience with UHV sealing, o-ring vs. metal seals, window sealing, TEC design, ultra low outgassing design, water and forced air cooling. Both Solidworks modeling/design and thermal analysis.
Must be USA based due to federal funding.
Creation of detailed shop drawings for fabrication. Will build prototypes and go to production.
Will be somewhat iterative and looking for optimal design.
Funded and ready to begin soon.
Looking for experience with UHV sealing, o-ring vs. metal seals, window sealing, TEC design, ultra low outgassing design, water and forced air cooling. Both Solidworks modeling/design and thermal analysis.
Must be USA based due to federal funding.
Creation of detailed shop drawings for fabrication. Will build prototypes and go to production.
Will be somewhat iterative and looking for optimal design.
Funded and ready to begin soon.