KiCad PCB & ANSYS Thermal Analysis
Budget: $30 – $250 USD
I already have a complete KiCad schematic; what I now need is a production-ready PCB layout and a subsequent thermal check in ANSYS. The board must follow a custom outline I’ll supply, so every track, keep-out and component footprint has to respect that shape from the very first routing pass.
Once the layout is finished, please export the full 3D model and bring it into ANSYS Workbench (or Icepak if you prefer) to simulate steady-state operation. I’m interested in realistic power dissipation on the key devices, overall temperature rise, and any hotspots created by copper pours or via stitching. The simulation should reflect standard FR-4 material properties; if additional data is required, just let me know and I’ll provide it.
Deliverables
• KiCad project folder with updated .kicad_pcb, footprints and 3D models
• Gerber and drill files ready for fabrication
• STEP/WRL of the assembled board matching the custom outline
• ANSYS file set and a brief report summarising assumptions, boundary conditions and temperature results (screenshots of the thermal map included)
I’ll share the mechanical drawing for the outline and the component placement priorities as soon as we start, and I’m happy to review intermediate builds so routing and thermal tweaks can be made early.
Once the layout is finished, please export the full 3D model and bring it into ANSYS Workbench (or Icepak if you prefer) to simulate steady-state operation. I’m interested in realistic power dissipation on the key devices, overall temperature rise, and any hotspots created by copper pours or via stitching. The simulation should reflect standard FR-4 material properties; if additional data is required, just let me know and I’ll provide it.
Deliverables
• KiCad project folder with updated .kicad_pcb, footprints and 3D models
• Gerber and drill files ready for fabrication
• STEP/WRL of the assembled board matching the custom outline
• ANSYS file set and a brief report summarising assumptions, boundary conditions and temperature results (screenshots of the thermal map included)
I’ll share the mechanical drawing for the outline and the component placement priorities as soon as we start, and I’m happy to review intermediate builds so routing and thermal tweaks can be made early.