ANSYS Thermoforming FEA Simulation

I need a detailed ANSYS Workbench study that recreates a vacuum-forming cycle applied to a polycarbonate sheet that has a pre-printed conductive ink layer. The goal is to replicate the heating, drape and vacuum draw, and subsequent cooling so I can 1) tune the forming parameters for the best wall-thickness distribution, 2) predict the stress-strain response of both the polymer and the ink, and 3) flag any regions where tearing, excessive thinning, loss of conductivity or other defects could occur.

The setup must couple thermal and structural physics, use temperature-dependent material data for polycarbonate, and model the ink as a thin composite layer so I can extract strain and resistance change histories. If you already have sub-routines or user-defined materials for printed silver or carbon inks, feel free to integrate them.

Please deliver:
• The complete ANSYS project with geometry, meshing, contacts and load-step definitions ready for me to rerun.
• A short PDF summary that explains assumptions, boundary conditions, key plots (thickness, principal strain, ink layer strain) and recommendations on parameter adjustments.
• Screenshots or animations that clearly visualise sheet draw and final thickness.

Acceptance is based on the model converging without manual intervention, matching baseline test data that I will supply, and highlighting at least three actionable design tweaks to minimise defects.