Consumer Device Double-Layer PCB Design

I have a new consumer-electronics build that hinges on a compact, double-layer PCB dedicated to clean, efficient power management. The board will sit at the heart of a handheld device, so I need a layout that balances tight spatial constraints with rock-solid reliability on both layers.

Scope of work
• Translate my block diagram into a full schematic, selecting components that meet the current-handling and thermal targets for our 5 V and 12v rail .
• Route a double-layer board, observing good separation between power and signal paths, low EMI, and clear test-point access for production.
• Deliver fabrication-ready Gerbers, drill files, pick-and-place data, and an organised BOM with manufacturer part numbers and footprints.
• Provide a brief design note explaining key decisions (thermal reliefs, plane splits, decoupling strategy).

Acceptance criteria
1. All design files open error-free in KiCad or Altium (your choice, just stay consistent).
2. DRC passes at 6 mil/6 mil clearance with no unconnected nets.
3. Voltage ripple stays within 50 mV under a 1 A load in SPICE or equivalent simulation.
4. Documentation is complete enough for the board house to manufacture without questions.

While the current revision only requires power-management circuitry, please keep future add-ons—such as wireless communication or signal-processing blocks—in mind so the layout can be expanded later without a complete redesign.

If you’re confident with double-layer power boards, EMI control, and consumer-grade miniaturisation, I’m ready to share the preliminary schematic and mechanical envelope right away.