Compact High-Speed PCB Design

Note: In Person Project, in Banglore, India and/or Mumbai, India
Note: Experience with High Speed PCB Design is mandatory / portfolio projects with EMMC.


The product is a compact IoT wearable that integrates:
• ESP32-S3 Mini Module (or similar)
• eMMC storage (4/8bit High speed interface)
• PDM microphones
• Haptic driver + LRA/ERM motor
• LED indicator (white)
• Battery charger, fuel gauge, protection circuitry
• Capacitive touch interface
This is a fully-SMT design with a 6-layer stack-up, tight spatial constraints, and high-speed nets requiring strict signal-integrity control.

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Form Factor & Constraints
• Max PCB size: ≤ 25 mm × 25 mm DIA Circle
• 6-layer impedance-controlled stack-up
• No through-hole components (except USBC or battery connector if absolutely required)
• Extremely limited routing area — every mm counts
• Must ensure manufacturable pad sizes, via clearances, and balanced copper

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High-Speed Requirements

You should be experienced with:
• USBc, eMMC, WiFi/BT RF keep-out rules
• Length matching & differential routing
• Clean return path design
• Via stubs, stitching vias, and controlled impedance
• High-speed simulation tools (optional but preferred)

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What I Expect to Receive

1. Final Schematic
• Altium or KiCad preferred
• Clean hierarchy, readable design, labelled nets
• Power tree + notes for decoupling and grounding

2. Optimised PCB Layout
• Impedance-controlled routing with annotated design rules
• Length matching tables (eMMC, high-speed buses, USB lines)
• Clear RF keep-outs (for ESP32)
• Thermal, grounding, stitching via strategy
• Balanced copper for all layers

3. Fabrication Package
• Gerbers (all layers)
• NC drill + via report
• Detailed layer stack-up
• Impedance table for manufacturer
• Fabrication notes (controlled impedance, material, tolerances)

4. Assembly Outputs
• Pick-and-place file
• Complete BOM with manufacturer part numbers
• 3D STEP model of the PCB for enclosure integration

5. Brief Design Report
• Routing constraints and justification
• Any signal integrity or EMI/PI considerations
• Simulation results (if performed)
• Manufacturing recommendations for the CM

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Ideal Candidate
• 3+ years hardware/PCB design experience
• Strong experience with tight-space consumer electronics
• Prior work with wearables, IoT modules, or RF/MCU boards
• Skilled in Altium / KiCad / Allegro
• Familiar with mass-production DFM/DFT practices
• Comfortable owning the design from schematic → production output

Timeline & Engagement
• Start immediately
• Long-term collaboration possible for future revisions and testing