Review & Validation of Dual-Rail Power Supply PCB (TPS63070, 3.3 V + 4.0 V for SIM800L + MCU)
Budget: €8 – €30 EUR
I have designed a custom PCB that powers a SIM800L GSM module and an MCU (CubeCell AB01) using two TPS63070 buck-boost regulators:
3.3 V rail → for MCU and logic
4.0 V rail → dedicated for SIM800L GSM module
The design includes inductors, feedback networks, decoupling capacitor banks, ferrite bead filtering, UART level shifting, and PWRKEY drive circuitry.
The PCB is already routed (first version). I need a professional electronics engineer to validate the entire power delivery design (both rails) and confirm PCB layout best practices.
Requirements / Tasks
Review the 3.3 V rail (TPS63070 configuration, component sizing, stability, decoupling).
Review the 4.0 V rail (TPS63070 configuration, bulk low-ESR cap, ceramics, bead, GSM burst handling).
Verify correct inductor and capacitor choices vs. TI datasheet recommendations.
Validate schematic for both rails, ensuring correct feedback divider values and compensation.
Validate PCB layout:
Placement of input/output capacitors
PGND/AGND separation
Loop area minimization
Thermal/trace sizing for 2 A+ GSM bursts
Confirm SIM800L supply cluster (1000 µF + 22 µF + 1 µF + 100 nF + ferrite bead) is adequate.
Confirm 3.3 V rail decoupling for stable MCU operation.
Provide recommendations for improvements if necessary.
Deliverables
Annotated schematic/PCB review (PDF or project markup).
Short written report (1–2 pages) with validation results and improvement suggestions.
Skills Required
Strong background in switching regulators & DC-DC power design.
Experience with TI TPS630xx family or similar.
Knowledge of GSM/IoT module power requirements (SIM800L or similar).
Familiarity with PCB design tools (KiCad/Altium/Eagle) for reviewing schematic + layout.
Files Available
Full schematic (PDF)
PCB layout (Gerber)
BOM with LCSC part numbers
Easyeda Pro project package
3.3 V rail → for MCU and logic
4.0 V rail → dedicated for SIM800L GSM module
The design includes inductors, feedback networks, decoupling capacitor banks, ferrite bead filtering, UART level shifting, and PWRKEY drive circuitry.
The PCB is already routed (first version). I need a professional electronics engineer to validate the entire power delivery design (both rails) and confirm PCB layout best practices.
Requirements / Tasks
Review the 3.3 V rail (TPS63070 configuration, component sizing, stability, decoupling).
Review the 4.0 V rail (TPS63070 configuration, bulk low-ESR cap, ceramics, bead, GSM burst handling).
Verify correct inductor and capacitor choices vs. TI datasheet recommendations.
Validate schematic for both rails, ensuring correct feedback divider values and compensation.
Validate PCB layout:
Placement of input/output capacitors
PGND/AGND separation
Loop area minimization
Thermal/trace sizing for 2 A+ GSM bursts
Confirm SIM800L supply cluster (1000 µF + 22 µF + 1 µF + 100 nF + ferrite bead) is adequate.
Confirm 3.3 V rail decoupling for stable MCU operation.
Provide recommendations for improvements if necessary.
Deliverables
Annotated schematic/PCB review (PDF or project markup).
Short written report (1–2 pages) with validation results and improvement suggestions.
Skills Required
Strong background in switching regulators & DC-DC power design.
Experience with TI TPS630xx family or similar.
Knowledge of GSM/IoT module power requirements (SIM800L or similar).
Familiarity with PCB design tools (KiCad/Altium/Eagle) for reviewing schematic + layout.
Files Available
Full schematic (PDF)
PCB layout (Gerber)
BOM with LCSC part numbers
Easyeda Pro project package
Related categories:
Electronics
Electrical Engineering
PCB Layout
Product Design
Embedded Systems
Schematic Review