Smart Glasses Hardware Development: Monocle System
Budget: $30 – $250 USD
Freelancer Requirement: Hardware Development for Smart Glasses (Based on Monocle Architecture)
We are looking for an experienced embedded hardware engineer to assist in designing, modifying, and optimizing a smart glasses electronics system based on the Monocle architecture. The system includes an FPGA, Bluetooth MCU, camera, microphone, OLED display, RAM, and power management circuits.
Scope of Work:
1. Review and Modify Existing Schematics
• Analyze the provided Monocle MK12 v2 schematics (PDF will be provided).
• Make modifications as needed to fit the custom smart glasses requirements.
• Ensure component optimization for power efficiency, size, and availability.
2. Component Selection & Integration
• Maintain key components, including:
• FPGA (GoWin GW1NR-9)
• Bluetooth MCU (Nordic nRF52832)
• Camera (Omnivision OV5640, MIPI CSI-2)
• Microphone (TDK ICS-41351, PDM)
• OLED Display (SPI interface)
• RAM (AP Memory APS256, 256Mb each, Octal SPI)
• Flash Memory (Winbond W25Q80E, 8Mb, SPI)
• Power Controllers (Maxim MAX77654, MAX17291)
• Ensure seamless I2C, SPI, and MIPI CSI-2 communication between components.
• Propose alternative components if necessary for improved performance or availability.
3. Power Optimization & Miniaturization
• Optimize power management to extend battery life.
• Ensure stable operation with 5V input and multiple voltage rails (1.2V, 1.8V, 2.7V, 10V).
• Minimize heat dissipation and power loss in wearable conditions.
4. PCB Design & Prototyping
• Design a compact, flexible PCB suitable for smart glasses.
• Implement best practices for high-speed signals, RF design, and power integrity.
• Generate Gerber files, BOM, and manufacturing documents.
5. Firmware & Communication Framework (Optional, but a plus)
• Assist with low-level firmware development for FPGA, Bluetooth, and sensor integration.
• Provide sample code for Bluetooth communication and camera interfacing.
Deliverables:
1. Updated Circuit Schematic (with necessary modifications).
2. Optimized PCB Design (Altium/KiCad/Eagle, including Gerber files).
3. Component List & BOM (Bill of Materials).
4. Prototyping Support (guidance for testing and debugging).
5. (Optional) Basic Firmware for Component Communication.
Ideal Candidate Requirements:
• Experience with wearable electronics and compact PCB design.
• Expertise in FPGA-based embedded systems.
• Proficiency in Altium, KiCad, or Eagle for PCB design.
• Familiarity with MIPI CSI-2, PDM, SPI, and I2C protocols.
• Knowledge of Bluetooth (nRF52832) and power management ICs.
• Ability to minimize power consumption and optimize PCB layout.
Application Requirements:
Interested candidates should provide:
1. Previous experience in wearable electronics and PCB design.
2. Examples of past FPGA or Bluetooth-based projects.
3. Estimated timeline and budget proposal.
Looking forward to collaborating!
We are looking for an experienced embedded hardware engineer to assist in designing, modifying, and optimizing a smart glasses electronics system based on the Monocle architecture. The system includes an FPGA, Bluetooth MCU, camera, microphone, OLED display, RAM, and power management circuits.
Scope of Work:
1. Review and Modify Existing Schematics
• Analyze the provided Monocle MK12 v2 schematics (PDF will be provided).
• Make modifications as needed to fit the custom smart glasses requirements.
• Ensure component optimization for power efficiency, size, and availability.
2. Component Selection & Integration
• Maintain key components, including:
• FPGA (GoWin GW1NR-9)
• Bluetooth MCU (Nordic nRF52832)
• Camera (Omnivision OV5640, MIPI CSI-2)
• Microphone (TDK ICS-41351, PDM)
• OLED Display (SPI interface)
• RAM (AP Memory APS256, 256Mb each, Octal SPI)
• Flash Memory (Winbond W25Q80E, 8Mb, SPI)
• Power Controllers (Maxim MAX77654, MAX17291)
• Ensure seamless I2C, SPI, and MIPI CSI-2 communication between components.
• Propose alternative components if necessary for improved performance or availability.
3. Power Optimization & Miniaturization
• Optimize power management to extend battery life.
• Ensure stable operation with 5V input and multiple voltage rails (1.2V, 1.8V, 2.7V, 10V).
• Minimize heat dissipation and power loss in wearable conditions.
4. PCB Design & Prototyping
• Design a compact, flexible PCB suitable for smart glasses.
• Implement best practices for high-speed signals, RF design, and power integrity.
• Generate Gerber files, BOM, and manufacturing documents.
5. Firmware & Communication Framework (Optional, but a plus)
• Assist with low-level firmware development for FPGA, Bluetooth, and sensor integration.
• Provide sample code for Bluetooth communication and camera interfacing.
Deliverables:
1. Updated Circuit Schematic (with necessary modifications).
2. Optimized PCB Design (Altium/KiCad/Eagle, including Gerber files).
3. Component List & BOM (Bill of Materials).
4. Prototyping Support (guidance for testing and debugging).
5. (Optional) Basic Firmware for Component Communication.
Ideal Candidate Requirements:
• Experience with wearable electronics and compact PCB design.
• Expertise in FPGA-based embedded systems.
• Proficiency in Altium, KiCad, or Eagle for PCB design.
• Familiarity with MIPI CSI-2, PDM, SPI, and I2C protocols.
• Knowledge of Bluetooth (nRF52832) and power management ICs.
• Ability to minimize power consumption and optimize PCB layout.
Application Requirements:
Interested candidates should provide:
1. Previous experience in wearable electronics and PCB design.
2. Examples of past FPGA or Bluetooth-based projects.
3. Estimated timeline and budget proposal.
Looking forward to collaborating!