Multi-layer PCB Layout for Consumer Electronics
Budget: ₹400 – ₹750 INR
I am looking for an experienced hardware/PCB designer to design a custom outdoor CPE (Customer Premises Equipment) PCB that integrates a Fibocom FM350-GL 5G M.2 module (NGFF) for high-speed 5G connectivity. The PCB should support outdoor industrial-grade use and include the following features:
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Core Requirements:
1. Power & Form Factor:
Power Input: PoE (Power over Ethernet) support, compliant with IEEE 802.3af/at.
PoE should power the entire board and the 5G module.
Outdoor enclosure compatible design (IP-rated casing will be handled separately, but consider mounting points and thermal constraints).
2. Connectivity:
2.5 Gigabit Ethernet port with PoE support (RJ45).
1x Gigabit Ethernet port (RJ45).
1x USB 3.0 Type-A port (for diagnostics or external peripherals).
SIM card slot (preferably standard 3FF form factor) with proper routing to M.2 slot.
1x Debug UART port (for development/debugging).
3. 5G Module Integration:
M.2 NGFF Key B slot (USB 3.0 + PCIe) for Fibocom FM350-GL.
NVMe support is not required unless you mean SSD usage; please clarify (we’ll use the M.2 primarily for FM350 module).
Proper USB 3.0 and PCIe lanes routing to the module.
SIM interface connected to the FM350.
4. Power Management:
Stable power delivery for FM350 (~3.3–3.6V @ 3A recommended).
Support for power-on/off control for the module.
ESD protection, voltage regulators, thermal protection.
Deliverables:
Complete schematic design.
PCB layout (preferably 4-layer or higher depending on routing needs).
BOM (Bill of Materials) with easily sourceable components.
Gerber files and assembly-ready outputs.
3D model for enclosure integration.
Guidance on thermal management and enclosure design for outdoor use.
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Other Notes:
Target use: Industrial/IoT-grade 5G outdoor CPE.
Must consider signal integrity for high-speed interfaces (USB 3.0, PCIe, 2.5G Ethernet).
Designer must have experience in high-speed PCB layout, PoE, and RF design considerations.
---
Core Requirements:
1. Power & Form Factor:
Power Input: PoE (Power over Ethernet) support, compliant with IEEE 802.3af/at.
PoE should power the entire board and the 5G module.
Outdoor enclosure compatible design (IP-rated casing will be handled separately, but consider mounting points and thermal constraints).
2. Connectivity:
2.5 Gigabit Ethernet port with PoE support (RJ45).
1x Gigabit Ethernet port (RJ45).
1x USB 3.0 Type-A port (for diagnostics or external peripherals).
SIM card slot (preferably standard 3FF form factor) with proper routing to M.2 slot.
1x Debug UART port (for development/debugging).
3. 5G Module Integration:
M.2 NGFF Key B slot (USB 3.0 + PCIe) for Fibocom FM350-GL.
NVMe support is not required unless you mean SSD usage; please clarify (we’ll use the M.2 primarily for FM350 module).
Proper USB 3.0 and PCIe lanes routing to the module.
SIM interface connected to the FM350.
4. Power Management:
Stable power delivery for FM350 (~3.3–3.6V @ 3A recommended).
Support for power-on/off control for the module.
ESD protection, voltage regulators, thermal protection.
Deliverables:
Complete schematic design.
PCB layout (preferably 4-layer or higher depending on routing needs).
BOM (Bill of Materials) with easily sourceable components.
Gerber files and assembly-ready outputs.
3D model for enclosure integration.
Guidance on thermal management and enclosure design for outdoor use.
---
Other Notes:
Target use: Industrial/IoT-grade 5G outdoor CPE.
Must consider signal integrity for high-speed interfaces (USB 3.0, PCIe, 2.5G Ethernet).
Designer must have experience in high-speed PCB layout, PoE, and RF design considerations.