Luxury Smart Ring Electronics Integration and PCBA Prototype

Go through the following documents thoroughly first:

https://aureaelite.com/ring
https://aureaelite.short.gy/aurea-flexistone-design-specs
https://link.aureaelite.com/pcb-cad-collab

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? Electronics Integration for Compact Smart Ring (BLE + Sensors)

Project Type: One-time project with milestone deliverables
Client: Aurea Elite – Luxury Smart Jewelry Brand
Location: Remote
Start Date: Immediate
Experience Level: Expert

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?️ What We Need:

We're developing a luxury smart ring (Aurea Flexistone Ring) that blends fine jewelry with embedded environmental sensors and Bluetooth connectivity. The ring has a sealed internal cavity of just roughly 20mm x 7mm x 3.5mm, and we need a skilled electronics integration engineer or firm to help us finalize the embedded tech stack.

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? Scope of Work:

- ✅ Review & Validate: Audit our list of miniature electronic components (ambient temp, humidity, EMF, accelerometer, BLE module, battery, Qi charging coil, flexible PCB).
- ✅ Fit Assessment: Ensure all components fit and function within the defined cavity size.
- ✅ Compatibility Check: Confirm electronic compatibility across all components; suggest viable substitutes if needed.
- ✅ Assemble: Design and/or prototype a fully functional flexible PCB layout that:
- Collects environmental data
- Uses ultra-low power (under 10 mA)
- Connects via BLE to a mobile app
- Supports wireless charging
- ✅ Prepare for Sealing: All components must work long-term in a hermetically sealed environment (resin/silicone encapsulated).

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? Component Snapshot (Provided with Links & Specs):

- Bluetooth Module: Nordic nRF52840 (~7x7x1 mm)
- Battery: Grepow Curved LiPo (~15x5x1.7 mm) or coin-cell
- Sensors: Temp, Humidity, Light, EMF, Accelerometer (all under 2.5 mm³)
- Flexible PCB: ~ 0.2 mm thick
- Qi Charging Coil: ~7x7x1 mm

Full specs & dimensions are provided in a detailed product document (attached).

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? Deliverables:

1. Confirmed bill of materials (BOM) with part dimensions and rationale
2. PCB design files (preferably using KiCad, Altium, or similar)
3. A working PCB prototype (shipped to us preferred, or verified through live test video)
4. Instructions for CAD modeler to ensure the cavity and PCB work together properly
5. Documentation for long-term operation under sealed conditions

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? Ideal Skills:

- PCB design for wearables / microelectronics
- BLE communication systems
- Qi wireless charging integration
- Familiarity with hermetically sealed or encapsulated electronics
- Strong component selection / sourcing experience
- (Bonus) Experience in luxury or medical-grade device design

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Below is a guidelines document to help you design better.

https://link.aureaelite.com/pcb-cad-collab

As your PCB design will dictate the jewelry CAD modeler's next steps, please review, update if necessary, and finalize this document to ensure it provides clear instructions for cavity design. Specifically, during your design:


1. Sensor Placement: Confirm positions and keepout zones to align with apertures/windows in the cavity.
2. Aperture Requirements: Specify dimensions and materials (e.g., sapphire/PTFE) for sensor functionality.
3. Mechanical Integration: Provide mounting details (e.g., studs, grease) and thermal pathways for sensors.
4. Sealing Considerations: Highlight dependencies between PCB design and hermetic sealing mechanisms.


Your finalized inputs will guide the jewelry CAD modeler to design a cavity that fully supports the PCBA’s functionality. Please update the document as needed to reflect your vision.


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This is not just another wearable.
You're helping build the first heirloom-grade smart ring.

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