Comsol Multiphysics Simulation: Simulation on Hot Stamping (Heat transfer)
Budget: $10 – $11 USD
This is Hot Stamping Process. Red one is blank material (Boron Steel) and Bottom one is (Tool Steel) Die.
There is a thermal contact between these surfaces. I have already developed a physical based equation for thermal contacts. Hc (Contact resistnace) , Hg (Lubricant resistance - lubricants used in hot stamping)
Temperature is constant around 340C and Pressure is increasing from zero to 30MPa (5MPa step)
As you can see, I have already input my equations Hc and Hg into the model and, I only need to vary the Pressure (P) with time 0 to 60 seconds by 5MPa steps and get the graph of Pressure vs Thermal contact (Hc).
There is a thermal contact between these surfaces. I have already developed a physical based equation for thermal contacts. Hc (Contact resistnace) , Hg (Lubricant resistance - lubricants used in hot stamping)
Temperature is constant around 340C and Pressure is increasing from zero to 30MPa (5MPa step)
As you can see, I have already input my equations Hc and Hg into the model and, I only need to vary the Pressure (P) with time 0 to 60 seconds by 5MPa steps and get the graph of Pressure vs Thermal contact (Hc).