Fusion360 PCB-to-KiCad Upgrade

I already have a fully captured schematic and a reference board outline in Autodesk Fusion 360; traces have not yet been laid. Before we move forward I’d like a seasoned eye to comb through both the schematic and preliminary placement, flag anything questionable, and then migrate the entire design to KiCad 9.0.

Primary focus: the board carries several 0.5 mm-pitch BGA parts that will need via-in-pad treatment. I must be confident the fan-out strategy, pad sizes, and drill specs will pass fabrication without yield issues. While BGA reliability comes first, you’ll also see an ultra-wide-band antenna path (≈8 GHz) that needs proper impedance matching, so comments or quick tweaks there are welcome.

Everything must line up with recognised industry standards for high-density interconnects and RF layout. No proprietary company rules—just the accepted IPC guidelines, controlled-impedance and via-in-pad best practices.

When you respond, show me past work that proves you have handled BGA escape routing or UWB/RF layouts in KiCad. A concise portfolio link or a couple of screenshots is perfect; I don’t need a full proposal deck.

Deliverables
• Review memo highlighting any show-stoppers or optimisation ideas
• Clean, validated KiCad 9.0 schematic and PCB files reflecting the agreed changes. Multi-sheet schematic should be used with block diagrams linked to internal modules.
• Updated libraries/footprints for the BGA and antenna elements
• Ready-for-fab outputs (Gerbers, drill, IPC-356 netlist) once the board passes DRC/ERC in KiCad

I’m keen to move quickly, so let me know how soon you can start and roughly how long the migration plus review will take.

Some of the ICs being used include:
- ISP2053 (integrated module for nRF5340 by Insight)
- Qorvo DW3220 Ultrawide Band Chip
- W25Q256 Flash IC
- ADP5360 PMIC
- ICM42670 IMU
- DRV2605 Haptic Driver (BGA version)
- WS2812 addressable LED (1mm x 1mm version)