Smart Beehive Monitoring System Design
Budget: $30 – $250 USD
I am looking for an experienced electronics engineer/PCB designer to create a custom carrier board (or fully integrated PCB) for a smart beekeeping monitoring system. The device will monitor two beehives simultaneously and transmit data via LoRaWAN to the "Beep" platform.
Project Scope: The goal is to design a PCB that handles power management and interfaces with multiple sensors for two separate hives. The device will be powered by a Solar panel and a Li-Ion/LiFePO4 battery.
Core Components & Requirements:
Microcontroller & Connectivity:
Based on ESP32 with LoRaWAN capabilities.
Preference: You can either design around a module (like ESP32-WROOM + RFM95) OR design a carrier board for a dev-board like the Heltec WiFi LoRa 32 V3 (to simplify assembly). Please specify your recommendation in your proposal.
Sensors (Interfaces needed for 2 Hives):
Weight: 2x Interfaces for Load Cells (4-wire). The PCB must integrate 2x HX711 ADC chips directly (or provide headers for breakout boards, though integrated chips are preferred for reliability).
Audio: 2x Interfaces for external I2S MEMS Microphones (e.g., INMP441). Connectors must be pin-compatible.
Temperature: Interface for 2x DS18B20 sensors (OneWire).
Power Management:
Input for 6V Solar Panel.
Battery management for 18650 Li-Ion or LiFePO4.
Efficient charging IC (e.g., CN3065 or similar appropriate for solar).
Crucial: Ultra-low power consumption optimization (deep sleep focus).
Connectors:
Robust connectors for external sensors (Screw terminals or JST-XH preferred) to withstand outdoor vibrations.
Deliverables:
KiCad (preferred) or EasyEDA project files.
Schematics (PDF).
Gerber Files for manufacturing.
BOM (Bill of Materials) with LCSC part numbers (optimized for JLCPCB assembly service).
CPL/Pick and Place files for assembly.
Ideal Candidate:
Experience with ESP32 and LoRaWAN hardware design.
Experience with low-noise audio routing (important for the FFT analysis on the ESP32).
Experience designing for JLCPCB assembly (using parts available in their library).
Project Scope: The goal is to design a PCB that handles power management and interfaces with multiple sensors for two separate hives. The device will be powered by a Solar panel and a Li-Ion/LiFePO4 battery.
Core Components & Requirements:
Microcontroller & Connectivity:
Based on ESP32 with LoRaWAN capabilities.
Preference: You can either design around a module (like ESP32-WROOM + RFM95) OR design a carrier board for a dev-board like the Heltec WiFi LoRa 32 V3 (to simplify assembly). Please specify your recommendation in your proposal.
Sensors (Interfaces needed for 2 Hives):
Weight: 2x Interfaces for Load Cells (4-wire). The PCB must integrate 2x HX711 ADC chips directly (or provide headers for breakout boards, though integrated chips are preferred for reliability).
Audio: 2x Interfaces for external I2S MEMS Microphones (e.g., INMP441). Connectors must be pin-compatible.
Temperature: Interface for 2x DS18B20 sensors (OneWire).
Power Management:
Input for 6V Solar Panel.
Battery management for 18650 Li-Ion or LiFePO4.
Efficient charging IC (e.g., CN3065 or similar appropriate for solar).
Crucial: Ultra-low power consumption optimization (deep sleep focus).
Connectors:
Robust connectors for external sensors (Screw terminals or JST-XH preferred) to withstand outdoor vibrations.
Deliverables:
KiCad (preferred) or EasyEDA project files.
Schematics (PDF).
Gerber Files for manufacturing.
BOM (Bill of Materials) with LCSC part numbers (optimized for JLCPCB assembly service).
CPL/Pick and Place files for assembly.
Ideal Candidate:
Experience with ESP32 and LoRaWAN hardware design.
Experience with low-noise audio routing (important for the FFT analysis on the ESP32).
Experience designing for JLCPCB assembly (using parts available in their library).