Senior Multi-layer PCB Design for Consumer Electronics

Project: Soil– Full Hardware Design Package (Schematic, Gerber, BOM)

We need a skilled hardware engineer to prepare a complete design pack for a smart soil testing device to be manufactured by MOKO Technology (China).

Deliverables:

Schematic (MCU + sensors + power)

Gerber files (all layers)

Bill of Materials (BOM with part numbers)

Pick & Place / Centroid files

3D PCB view (optional)

All files MOKO-ready


Includes:

MCU, Bluetooth, battery-powered design

EC, pH, NPK, and moisture sensor interfaces

Optional LoRa support

Compact consumer device layout


Must have:

Experience with MOKO/Seeed/JLCPCB

Tools: Altium / KiCad / Eagle

NDA signing