Looking for an Embedded Hardware Engineer for a Custom Rockchip RV1106 / 4G LTE IoT Smart PCB Design

We are developing an open-source, ultra-thin wearable assistive device. We need an experienced Embedded Hardware Engineer to design a custom multi-layer PCB and select appropriate components based on our provided PRD (Product Requirement Document).

Key Responsibilities:

Schematic capture and Multi-layer PCB Layout design (Target dimensions: within 60x80mm, ultra-thin profile).

Integration of Rockchip RV1106 SoC with 8GB eMMC and a 4G LTE modem module.

Integration of an I2S audio amplifier (MAX98357A or equivalent) optimized for a high-power inductive coil output.

Implementation of a dual-microphone setup (onboard MEMS + wireless receiver circuit) and BLE/2.4GHz links for external modular switches.

Optimization for high-density 3.7V Li-Po battery placement and proper thermal dissipation mapping (graphene/copper insulation).

Delivering production-ready Gerber files, BOM (Bill of Materials), and CPL files.

Requirements:

Proven experience with ARM Cortex/Rockchip SoC hardware designs.

Experience with high-speed digital layout and RF tuning (4G, Wi-Fi, BLE).

Ability to sign an NDA before receiving full functional details.