Integrating Wi-Fi, BLE, and Haptics on Embedded Linux with Qualcomm & Broadcom SoCs
Budget: $750 – $1,500 CAD
Summary
Seeking an experienced Firmware Engineer to lead embedded software design for next-generation wireless SSD and haptic control systems. This role involves high-speed data interfaces (PCIe, NVMe), advanced wireless technologies (Wi-Fi 6/6E/7, BLE), and integration of sensors and audio peripherals.
Key Responsibilities:
- Develop, optimize, and debug firmware for SoCs with PCIe and Wi-Fi 6/7 integration (Qualcomm, Broadcom, MediaTek, NXP platforms).
- Design and implement wireless SSD firmware for PCIe NVMe communication, caching, and file management.
- Integrate BLE/Audio SoCs for wireless communication and audio streaming.
- Implement DSP control for audio signal processing, Class D amplification, and haptic actuation.
- Interface with and calibrate IMU, weight, temperature, and humidity sensors.
- Develop drivers for LEDs, fans, and peripheral control.
- Optimize NAND flash (PCIe NVMe) drivers and data transfer reliability.
- Support Wi-Fi/BLE protocol stacks, security, and coexistence for real-time storage and audio applications.
- Collaborate with hardware and application teams for system bring-up, debug, and field testing.
- Maintain modular, reusable firmware architectures for scalability.
Required Skills & Experience:
- Proven expertise in bare-metal or RTOS firmware for Qualcomm, Broadcom, MediaTek, or NXP wireless SoCs.
- Strong knowledge of PCIe/NVMe, high-speed peripheral drivers, and wireless stacks.
- Proficiency in C/C++, DMA, interrupts, memory, and power management.
- Experience with BLE/LE Audio or Bluetooth streaming.
- Familiarity with DSP audio algorithms and real-time processing.
- Practical knowledge of I2C/SPI, RAM, and power sequencing.
- Hands-on with bootloaders, secure/OTA firmware updates, and CI/CD automation.
Project Deliverables
1. Firmware Source Code
- Modular C/C++ codebase with full documentation
- Integrated PCIe NVMe and wireless SoC components
- RTOS scheduling and sensor control logic implemented
2. Driver & Middleware Layer
- Drivers for PCIe, Wi-Fi, BLE, NAND, DSP, and sensors
3. Testing & Validation
- Bench-level debugging and validation
- Wireless throughput and SSD latency benchmarking
- Haptic/audio calibration and performance tuning
4. Documentation
- Firmware architecture overview
- Release notes and version control logs
Important Notes:
- Project Duration: Expected 2 months.
Seeking an experienced Firmware Engineer to lead embedded software design for next-generation wireless SSD and haptic control systems. This role involves high-speed data interfaces (PCIe, NVMe), advanced wireless technologies (Wi-Fi 6/6E/7, BLE), and integration of sensors and audio peripherals.
Key Responsibilities:
- Develop, optimize, and debug firmware for SoCs with PCIe and Wi-Fi 6/7 integration (Qualcomm, Broadcom, MediaTek, NXP platforms).
- Design and implement wireless SSD firmware for PCIe NVMe communication, caching, and file management.
- Integrate BLE/Audio SoCs for wireless communication and audio streaming.
- Implement DSP control for audio signal processing, Class D amplification, and haptic actuation.
- Interface with and calibrate IMU, weight, temperature, and humidity sensors.
- Develop drivers for LEDs, fans, and peripheral control.
- Optimize NAND flash (PCIe NVMe) drivers and data transfer reliability.
- Support Wi-Fi/BLE protocol stacks, security, and coexistence for real-time storage and audio applications.
- Collaborate with hardware and application teams for system bring-up, debug, and field testing.
- Maintain modular, reusable firmware architectures for scalability.
Required Skills & Experience:
- Proven expertise in bare-metal or RTOS firmware for Qualcomm, Broadcom, MediaTek, or NXP wireless SoCs.
- Strong knowledge of PCIe/NVMe, high-speed peripheral drivers, and wireless stacks.
- Proficiency in C/C++, DMA, interrupts, memory, and power management.
- Experience with BLE/LE Audio or Bluetooth streaming.
- Familiarity with DSP audio algorithms and real-time processing.
- Practical knowledge of I2C/SPI, RAM, and power sequencing.
- Hands-on with bootloaders, secure/OTA firmware updates, and CI/CD automation.
Project Deliverables
1. Firmware Source Code
- Modular C/C++ codebase with full documentation
- Integrated PCIe NVMe and wireless SoC components
- RTOS scheduling and sensor control logic implemented
2. Driver & Middleware Layer
- Drivers for PCIe, Wi-Fi, BLE, NAND, DSP, and sensors
3. Testing & Validation
- Bench-level debugging and validation
- Wireless throughput and SSD latency benchmarking
- Haptic/audio calibration and performance tuning
4. Documentation
- Firmware architecture overview
- Release notes and version control logs
Important Notes:
- Project Duration: Expected 2 months.