Battery-Powered BLE Puck PCB Design

## Project Summary
Battery‑powered BLE puck (∅40 mm) using Raytac MDBT50Q‑1MV2 (nRF52840), Bosch BME688 and TI TMP117 on shared I²C with supporting passive components for a robust design. Schematics & pcb layout
Goal: professional PCB layout with RF‑safe antenna area and ultra‑low‑power focus.

## Deliverables Requested
- PCB layout in EasyEDA format with:
- Correct antenna keep‑out (no copper/vias/components Top & Bottom) ≥10 mm around antenna tip.
- Round board outline (Ø 40 mm).
- Proper decoupling placement: 100 nF + 1 µF + 4.7 µF at U1; 100 nF at U2,U3; 220 µF bulk on VBAT away from antenna.
- Test pads: VBAT, GND, SCL, SDA, BAT_SENSE, TX, RX; SWD pads (TC2030) accessible.
- I²C pull‑ups 10 k to VBAT; optional 22 Ω series near U1.
- TMP117 thermally isolated; BME688 with air access holes (slots) suggested.
- Battery sense divider 2.2 M / 2.2 M with 100 nF to GND routed away from RF area.

## Provided Inputs (see /inputs)
- BOM: `PUC-nRF-Design_BOM.csv`
- Netlists: `PUC-nRF-Design_Netlist.csv` (tabular) and `PUC-nRF-Design_Protel_Netlist.net` (Protel style)
- 3D STEP models: MDBT50Q‑1MV2, BME688, TMP117
- Board outline DXF: `Board_Outline_40mm.dxf`
- Antenna keep‑out DXF: `Antenna_Keepout_Rect.dxf`

## Fabrication Targets
- Layers: 2, FR‑4, 1.6 mm, 1 oz Cu, Green solder mask, white silkscreen
- Min trace/space: 0.15/0.15 mm
- Min via: 0.3/0.6 mm
- Finish: ENIG preferred (HASL LF acceptable)
- Round board 40 mm diameter; consider two 3 mm mounting holes if space allows

## Notes for RF
- Place MDBT50Q‑1MV2 at the board edge with antenna pointing outward.
- Enforce keep‑out (Top & Bottom) around antenna; no ground pour, no vias.
- Keep high current pulses (bulk cap, battery tab) away from antenna end.

## Acceptance
- DRC clean
- 3D preview matches STEP envelopes
- Gerber/Drill + Pick&Place + BOM output provided
- Prototype validated by us before final payment