Multi-Layer PADS PCB Design

I am developing an industrial-grade board and need an experienced designer who works comfortably inside Siemens PADS. The job centers on a tight, multi-layer layout that hosts both microcontrollers and several power-management ICs, so clean power planes, controlled impedance traces, and rock-solid grounding techniques are critical.

Here’s what I expect from you:
• Capture the schematic (or import mine) and translate it into a manufacturable PADS layout.
• Route every layer with proper clearances, via strategy, and DRC compliance.
• Deliver complete Gerbers, drill files, BOM, and the native PADS project so I can iterate internally if needed.

I’ll provide component datasheets, existing schematics, and mechanical constraints as soon as we start. If you have a proven track record of releasing multi-layer industrial boards in PADS, let’s talk—turnaround and attention to detail will decide the hire.