Two-Layer FR4 PCB Revision

I have an existing two-layer FR4 board that now needs a clean Rev 2 spin for a consumer-electronics application. The current schematic and PCB files (KiCad) are available; the goal is to tighten the layout, correct a few routing issues around the microcontroller, and add a properly-impedance-controlled USB interface brought out to a Type-C connector. No RF sections are involved, so the focus remains on signal integrity, power distribution, and manufacturability on standard 1-oz copper, 1.6 mm FR4.

Please keep the microcontroller footprint unchanged, as the firmware team is already locked to that part. All other passives can move if it improves routing or clears DFM constraints. I also need silk updates for clearer assembly markings.

Deliverables
• Updated schematic and PCB source files (KiCad)
• Production-ready Gerbers, drill files, and IPC-356 netlist
• Updated BOM with any new part numbers or values
• Brief change log highlighting every modification from Rev 1

Acceptance criteria
• USB differential pairs length-matched within ± 0.25 mm and routed as 90 Ω ±10 % differential impedance
• All design rule checks pass at JLCPCB default specs with 0 errors
• No new air-wires, unconnected nets, or acute trace angles below 45°

Once the Rev 2 package meets these points, the project is complete and ready for fabrication.