6-Layer 1000-Pad PCB Layout
Budget: $100 – $200 USD
The full schematic is complete in KiCAD; what I now need is a production-ready 6-layer layout of roughly 1 000 pads for an item of industrial equipment. The design includes several high-speed connectors that must be positioned and routed with controlled impedance and tight length matching, so familiarity with differential pair tuning, via-in-pad, return-path integrity and other high-speed best practices is essential.
Please use KiCAD for the entire workflow and apply a layer stack that balances signal integrity, power integrity and manufacturability. I expect you to:
• optimise component placement for thermal management and serviceability
• route high-speed nets with proper impedance control and matched lengths
• segregate noisy and sensitive sections, observing industrial EMC guidelines
• generate clean power planes and stitch grounds to minimise loop area
• deliver DFM-ready files: .kicad_pcb, Gerbers, drill files, pick-and-place, 3D step, and a concise fabrication/assembly drawing
Acceptance criteria
1. All high-speed pairs within ±50 mil of the reference length, impedance within the stack-up tolerance.
2. No DRC, ERC or manufacturer blockers at the chosen 6-layer stack-up.
3. Files open error-free in the latest KiCAD stable release and pass an external Gerber viewer check.
If you have a proven track record with similar high-density, multilayer industrial boards, I’d be happy to review your portfolio and move forward.
Please use KiCAD for the entire workflow and apply a layer stack that balances signal integrity, power integrity and manufacturability. I expect you to:
• optimise component placement for thermal management and serviceability
• route high-speed nets with proper impedance control and matched lengths
• segregate noisy and sensitive sections, observing industrial EMC guidelines
• generate clean power planes and stitch grounds to minimise loop area
• deliver DFM-ready files: .kicad_pcb, Gerbers, drill files, pick-and-place, 3D step, and a concise fabrication/assembly drawing
Acceptance criteria
1. All high-speed pairs within ±50 mil of the reference length, impedance within the stack-up tolerance.
2. No DRC, ERC or manufacturer blockers at the chosen 6-layer stack-up.
3. Files open error-free in the latest KiCAD stable release and pass an external Gerber viewer check.
If you have a proven track record with similar high-density, multilayer industrial boards, I’d be happy to review your portfolio and move forward.