PCB Designer for Ultra-Low Power IoT Device (Multi-Radio, LiSOCl2, Industrial Rugged)
Budget: $1,500 – $3,000 USD
We are seeking an expert PCB hardware designer to develop an industrial-grade, ultra-low power IoT asset tracker. Our product integrates multi-radio connectivity (LTE Cat-1 bis, LoRa, WiFi, BLE), low-power microcontroller, sensors, and is powered by a primary LiSOCl2 cell. The device is intended for reusable assets (e.g. smart pallets, containers) and must offer the lowest possible BOM cost with high reliability.
Required Skills & Experience:
Proven experience with designing ultra-low power IoT devices (sub-10uA average currents).
PCB layout expertise for combined cellular (LTE Cat-1 bis, NB-IoT), LoRa, WiFi, BLE modules—ideally with experience in multi-radio coexistence on a single board.
Experience with LiSOCl2 battery-powered designs (including primary cell safety, low leakage, and low self-discharge).
Understanding and application of DFM principles (Design for Manufacturing) and cost optimization.
Hands-on with IPC standards, PCB stack-up for RF and battery-powered circuits, and ESD/EMC best practices (IP67/IP68 enclosure constraints a plus).
Solid experience with sensor integration (accelerometers, IMU, temperature/humidity/ambient light sensors).
Comfortable with MCU-based hardware platforms (STM32, Nordic, Espressif, etc.).
Ability to generate complete BOM, design review documentation, and test points for manufacturing/debug.
Experience with wireless antenna design/layout (external/internal) and RF matching.
Proficiency with Altium Designer, KiCAD, or Eagle (share portfolio/examples).
Clear communication in English (all documentation, silk, schematic labels, and comments).
Desirable (Bonus):
Prior experience designing for assets tracking, logistics, or industrial IoT applications.
Knowledge in battery longevity simulation for primary cells and supercapacitor balancing/protection.
Familiarity with IP67/industrial enclosure design implications on PCB layout and antenna strategy.
Basic firmware bring-up capability for circuit validation.
Ability to provide 3D models for mechanical integration.
Scope of Work:
Review and discuss block diagram and system requirements with our team.
Make recommendations on BOM for optimal cost/performance.
Produce full schematic with clear labeling and documentation.
Complete PCB layout (1–2 sided, considering mechanical constraints and RF integrity).
DFM review, Gerber files, manufacturing outputs, and annotated test point placements.
Attend short sync meetings online for review and feedback.
All schematics, silkscreens, and documentation in English.
Optional: Quick prototype/debug support (billable separately).
To apply, send:
Brief summary of relevant IoT/low-power multi-radio product experience.
Portfolio (screenshots, PDFs, Gerbers, or links).
Preferred CAD tool(s).
Earliest availability and typical project timelines.
References (optional, but welcome).
Budget: USD 1,500–2,500, contract by milestone, negotiable for exceptional experience
Milestone Plan for IoT PCB Design Project
Milestone 1: Block Diagram & Initial BOM Proposal
Deliverables:
Reviewed and annotated block diagram.
Preliminary BOM (with part numbers, datasheets, and key choices explained).
Review of pinout, critical paths, and mechanical constraints.
Payment: 15% of total project fee
Goal: Ensure full alignment on system architecture and critical component selection before proceeding.
Milestone 2: Complete Schematic Capture & BOM Finalization
Deliverables:
Full schematic (with all nets, hierarchy, well-labeled components).
Finalized and updated BOM (including RF modules, sensors, battery, PMIC, passives, etc.).
Annotated notes for interfaces, test points, programming/debug, and preliminary board sizing suggestions.
Payment: 30% of total project fee
Goal: Validate circuit design and finalize component selection before PCB layout to avoid costly changes later.
Milestone 3: PCB Layout & DRC/DFM Review
Deliverables:
PCB layout files (Altium, KiCAD, Eagle, etc.), with Design Rule Check (DRC) and Design for Manufacturing (DFM) review complete.
Placement screenshots or PDFs for review.
Key RF/EMC recommendations applied: antenna placement, grounding, signal integrity, battery routing, IP67 precautions.
1–2 iterations for feedback and minor corrections.
Payment: 35% of total project fee
Goal: Ensure electrical and RF integrity, manufacturability, and design readiness for fabrication.
Milestone 4: Final Manufacturing Outputs & Documentation
Deliverables:
Gerber files, BOM in manufacturer format (CSV/XLS), Pick & Place, assembly drawings.
3D files if available (STEP, PDF).
Final documentation including troubleshooting notes, test point map, and quick bring-up guide.
All design source files and exports/archives.
Payment: 20% of total project fee
Goal: Provide everything needed for prototype fabrication and assembly, including full documentation and source files.
Required Skills & Experience:
Proven experience with designing ultra-low power IoT devices (sub-10uA average currents).
PCB layout expertise for combined cellular (LTE Cat-1 bis, NB-IoT), LoRa, WiFi, BLE modules—ideally with experience in multi-radio coexistence on a single board.
Experience with LiSOCl2 battery-powered designs (including primary cell safety, low leakage, and low self-discharge).
Understanding and application of DFM principles (Design for Manufacturing) and cost optimization.
Hands-on with IPC standards, PCB stack-up for RF and battery-powered circuits, and ESD/EMC best practices (IP67/IP68 enclosure constraints a plus).
Solid experience with sensor integration (accelerometers, IMU, temperature/humidity/ambient light sensors).
Comfortable with MCU-based hardware platforms (STM32, Nordic, Espressif, etc.).
Ability to generate complete BOM, design review documentation, and test points for manufacturing/debug.
Experience with wireless antenna design/layout (external/internal) and RF matching.
Proficiency with Altium Designer, KiCAD, or Eagle (share portfolio/examples).
Clear communication in English (all documentation, silk, schematic labels, and comments).
Desirable (Bonus):
Prior experience designing for assets tracking, logistics, or industrial IoT applications.
Knowledge in battery longevity simulation for primary cells and supercapacitor balancing/protection.
Familiarity with IP67/industrial enclosure design implications on PCB layout and antenna strategy.
Basic firmware bring-up capability for circuit validation.
Ability to provide 3D models for mechanical integration.
Scope of Work:
Review and discuss block diagram and system requirements with our team.
Make recommendations on BOM for optimal cost/performance.
Produce full schematic with clear labeling and documentation.
Complete PCB layout (1–2 sided, considering mechanical constraints and RF integrity).
DFM review, Gerber files, manufacturing outputs, and annotated test point placements.
Attend short sync meetings online for review and feedback.
All schematics, silkscreens, and documentation in English.
Optional: Quick prototype/debug support (billable separately).
To apply, send:
Brief summary of relevant IoT/low-power multi-radio product experience.
Portfolio (screenshots, PDFs, Gerbers, or links).
Preferred CAD tool(s).
Earliest availability and typical project timelines.
References (optional, but welcome).
Budget: USD 1,500–2,500, contract by milestone, negotiable for exceptional experience
Milestone Plan for IoT PCB Design Project
Milestone 1: Block Diagram & Initial BOM Proposal
Deliverables:
Reviewed and annotated block diagram.
Preliminary BOM (with part numbers, datasheets, and key choices explained).
Review of pinout, critical paths, and mechanical constraints.
Payment: 15% of total project fee
Goal: Ensure full alignment on system architecture and critical component selection before proceeding.
Milestone 2: Complete Schematic Capture & BOM Finalization
Deliverables:
Full schematic (with all nets, hierarchy, well-labeled components).
Finalized and updated BOM (including RF modules, sensors, battery, PMIC, passives, etc.).
Annotated notes for interfaces, test points, programming/debug, and preliminary board sizing suggestions.
Payment: 30% of total project fee
Goal: Validate circuit design and finalize component selection before PCB layout to avoid costly changes later.
Milestone 3: PCB Layout & DRC/DFM Review
Deliverables:
PCB layout files (Altium, KiCAD, Eagle, etc.), with Design Rule Check (DRC) and Design for Manufacturing (DFM) review complete.
Placement screenshots or PDFs for review.
Key RF/EMC recommendations applied: antenna placement, grounding, signal integrity, battery routing, IP67 precautions.
1–2 iterations for feedback and minor corrections.
Payment: 35% of total project fee
Goal: Ensure electrical and RF integrity, manufacturability, and design readiness for fabrication.
Milestone 4: Final Manufacturing Outputs & Documentation
Deliverables:
Gerber files, BOM in manufacturer format (CSV/XLS), Pick & Place, assembly drawings.
3D files if available (STEP, PDF).
Final documentation including troubleshooting notes, test point map, and quick bring-up guide.
All design source files and exports/archives.
Payment: 20% of total project fee
Goal: Provide everything needed for prototype fabrication and assembly, including full documentation and source files.