PCB Design and Circuit Optimization - 4 Layers Circuit 12*12 cm

Scope of Work & Deliverables
1. Circuit & Component Simulation
Validate and simulate critical sub-circuits and component behaviors before moving to the layout stage (using LTspice, PSpice, or equivalent).

Optimize the power delivery network (PDN), specifically the integration between the HLK power module and the ESP32, ensuring proper noise filtering, decoupling, and voltage stability.

2. Schematic Review & Optimization
Comprehensive audit of the existing schematic for signal integrity, protection circuits, and component ratings.

Ensure proper implementation of hardware protection (e.g., TVS diodes, fuses, surge protection).

3. Thermal Simulation & Management (High Priority)
Perform full Thermal Simulation (FEA/CFD) of the PCB and components under continuous 24/7 workload.

Identify thermal hotspots (especially around the HLK module and power tracks) and implement mitigation strategies (thermal vias, copper pours, or heatsink placement).

4. PCB Design & Layout (High-Power & Logic Separation)
Design a multi-layer PCB focusing on Design for Manufacturing (DFM).

Strict implementation of Galvanic Isolation and signal separation.

Isolate high-power AC/DC tracks from low-voltage logic/RF signals (ESP32) to prevent EMI/EMC interference.

Adhere to strict Creepage and Clearance distance standards for safety and isolation.