Hardware Development Engineer for Consumer-Grade Embedded System
Budget: $750 – $1,500 USD
We are seeking an experienced Hardware Development Engineer to lead the end-to-end hardware development of a consumer-grade embedded system. The role involves system-level architecture, component selection, schematic design, PCB layout, and hardware validation in collaboration with the firmware engineer. The engineer must strictly adhere to the milestone plan and deliverables outlined below.
Key Responsibilities:
- System-level hardware architecture and design freeze.
- Component selection (MCU/SoC, power ICs, storage interfaces, wireless modules).
- Schematic design and PCB layout (high-speed + mixed-signal, EMI-aware).
- Power integrity, grounding, shielding, and DFM/DFA compliance.
- Prototype fabrication support and manufacturer Q&A.
- Hardware bring-up support and validation with firmware engineer.
- Clear documentation for handover and future revisions.
Deliverables / Milestones:
1. Milestone 1 – System Architecture & Design Freeze (10 days):
- System block diagram, MCU/SoC selection with justification, storage interface definition, power budget & thermal assumptions, preliminary BOM with cost estimates, key risks & assumptions.
2. Milestone 2 – Schematic Design + PCB Layout (14 days):
- Complete Altium schematic and PCB layout, ERC/DRC-clean design, stack-up and impedance details, manufacturing files (Gerber, PnP, BOM), design notes (PDF + native files).
3. Milestone 2-Extension – Prototype Fabrication Support:
- Manufacturer Q&A support, assembly file verification, footprint/polarity confirmation.
4. Milestone 5 – Integration & Handover (7 days):
- Schematics, PCB files, BOM handover; bring-up notes; hardware validation support; test points/debug guidance.
Preferred Freelancer Locations:
China, Japan, Taiwan, South Korea, Thailand, Vietnam, Eastern Europe, India. Experience with consumer electronics and mixed-signal designs is mandatory. Prior experience with EU/US consumer products is strongly preferred.
Timeline: Fixed by milestones as detailed above.
Key Responsibilities:
- System-level hardware architecture and design freeze.
- Component selection (MCU/SoC, power ICs, storage interfaces, wireless modules).
- Schematic design and PCB layout (high-speed + mixed-signal, EMI-aware).
- Power integrity, grounding, shielding, and DFM/DFA compliance.
- Prototype fabrication support and manufacturer Q&A.
- Hardware bring-up support and validation with firmware engineer.
- Clear documentation for handover and future revisions.
Deliverables / Milestones:
1. Milestone 1 – System Architecture & Design Freeze (10 days):
- System block diagram, MCU/SoC selection with justification, storage interface definition, power budget & thermal assumptions, preliminary BOM with cost estimates, key risks & assumptions.
2. Milestone 2 – Schematic Design + PCB Layout (14 days):
- Complete Altium schematic and PCB layout, ERC/DRC-clean design, stack-up and impedance details, manufacturing files (Gerber, PnP, BOM), design notes (PDF + native files).
3. Milestone 2-Extension – Prototype Fabrication Support:
- Manufacturer Q&A support, assembly file verification, footprint/polarity confirmation.
4. Milestone 5 – Integration & Handover (7 days):
- Schematics, PCB files, BOM handover; bring-up notes; hardware validation support; test points/debug guidance.
Preferred Freelancer Locations:
China, Japan, Taiwan, South Korea, Thailand, Vietnam, Eastern Europe, India. Experience with consumer electronics and mixed-signal designs is mandatory. Prior experience with EU/US consumer products is strongly preferred.
Timeline: Fixed by milestones as detailed above.