Fusion PCB Layout University Compliance

I already have a finalized schematic in Autodesk Fusion Electronics; what I now need is the physical PCB layout completed—nothing more, nothing less. Any electrical changes are off-limits unless I give written approval first.

The board must be a simple rectangle (70mm x 70mm) with 4 mm corner radii so it drops straight into our enclosure. USB-C and Micro-SD connectors have to sit flush with the case wall, and the environmental sensor needs to sit in its own cool pocket, thermally isolated from processors, regulators, or other heat sources you may spot while routing.

My top priority is full compliance with the university’s design rules. I’ll send the official checklist and guideline PDF; follow it to the letter. For the enclosure you can rely on standard Fusion 360 practices—keep mounting holes, keep-outs, and connector heights in mind so everything lines up when we print the housing. Beyond the sensor and the two external connectors, place parts according to best practice for signal integrity and manufacturability.

Key acceptance criteria
• Fusion Electronics (.f3d/.brd) file with all tracks, pours, and keep-outs complete
• Board outline: rectangle, 4 mm corner radius, dimensions taken from the brief
• USB-C and Micro-SD accessible from the exterior face as indicated
• Environmental sensor thermally isolated (minimum spacing per guideline, no copper under sensor)
• DRC passes using the university rule set without errors or warnings
• All design rule, layer stack, and naming conventions preserved exactly as in the schematic
• Delivery no later than Sunday, 22 February 2026

Hand over the native Fusion file plus Gerbers so I can run a final review and send it straight to the board house.