Acelerometer Compact Motion-Tracking Sensor Node Design with bluetooth and memory
Budget: €1,500 – €3,000 EUR
Project Description:
I am looking for an experienced electronics design engineer with a background in Nordic Semiconductor SoCs to develop a compact, high-efficiency PCB for a motion-tracking sensor node.
Hardware Requirements:
MCU: Nordic nRF52810 (BLE 5.0 SoC).
Sensor: STMicroelectronics LIS2DW12 (3-axis accelerometer, ultra-low power).
Memory: Winbond (1024Mb SPI Flash) to store 30 days of data at 12Hz.
Power Source: CR2032 or CR2050 Coin Cell Battery (Design must be optimized for low peak current/high internal resistance).
Antenna: Integrated PCB Trace Antenna or Ceramic Chip Antenna (with impedance matching network).
Required Deliverables:
Full Schematic: (PDF and source files).
PCB Layout: 2-layer design, compact form factor (approx. 25x25mm to 30x30mm).
Fabrication Files: (Gerber RS-274X, Excellon Drill) ready for PCBWay/JLCPCB.
Assembly Files: Pick & Place / Centroid file for automated SMT assembly.
BOM (Bill of Materials): Updated Excel file with exact Manufacturer Part Numbers (MPN).
Design Constraints:
Surface Finish: Optimized for ENIG finish to ensure battery contact reliability.
Power Consumption: Deep sleep current target < 5µA. Efficient power rail decoupling is a must.
DFM (Design for Manufacturing): The board must be easy to mass-produce (1,000+ units). Include Test Points for SWD programming and functional testing.
Candidate Profile:
Strong experience in RF layout (Bluetooth) and battery-optimized IoT devices. Please provide examples of previous work involving Nordic nRF52 series and SPI Flash integration.
I am looking for an experienced electronics design engineer with a background in Nordic Semiconductor SoCs to develop a compact, high-efficiency PCB for a motion-tracking sensor node.
Hardware Requirements:
MCU: Nordic nRF52810 (BLE 5.0 SoC).
Sensor: STMicroelectronics LIS2DW12 (3-axis accelerometer, ultra-low power).
Memory: Winbond (1024Mb SPI Flash) to store 30 days of data at 12Hz.
Power Source: CR2032 or CR2050 Coin Cell Battery (Design must be optimized for low peak current/high internal resistance).
Antenna: Integrated PCB Trace Antenna or Ceramic Chip Antenna (with impedance matching network).
Required Deliverables:
Full Schematic: (PDF and source files).
PCB Layout: 2-layer design, compact form factor (approx. 25x25mm to 30x30mm).
Fabrication Files: (Gerber RS-274X, Excellon Drill) ready for PCBWay/JLCPCB.
Assembly Files: Pick & Place / Centroid file for automated SMT assembly.
BOM (Bill of Materials): Updated Excel file with exact Manufacturer Part Numbers (MPN).
Design Constraints:
Surface Finish: Optimized for ENIG finish to ensure battery contact reliability.
Power Consumption: Deep sleep current target < 5µA. Efficient power rail decoupling is a must.
DFM (Design for Manufacturing): The board must be easy to mass-produce (1,000+ units). Include Test Points for SWD programming and functional testing.
Candidate Profile:
Strong experience in RF layout (Bluetooth) and battery-optimized IoT devices. Please provide examples of previous work involving Nordic nRF52 series and SPI Flash integration.