KiCad PCB for DSP Prototype
Budget: $250 – $750 USD
The complete schematic for my digital-audio signal-processor prototype is ready; now I need it turned into a set of production-ready PCBs in KiCad. There will be three boards in this job. Two will be approximately 110mm by 100mm. The codec board may require a multilayer stack-up. Hopefully the analog IO boards can be accomplished on two-layer boards and accommodate the specified audio connectors along one edge for easy panel mounting.
The schematic is already in Kicad 9.0. Footprints and 3d models are in place. You will need to decide the optimal layer order, and route every net with good mixed-signal practices—quiet star ground plane, short high-speed traces, and clean separation of analogue and digital domains. When you are done I should be able to hand the files straight to a board house and receive a working board without further tweaks.
Deliverables & acceptance criteria
• Native KiCad project (schematic + PCB) that opens error-free
• Gerbers, drill files, pick-and-place, and BOM ready for JLCPCB’s 5/5 mil rules
• Board outline ≤ 200 mm × 200 mm and at least four layers with a solid ground plane
• Audio connectors correctly positioned for front-panel use
• All DRC and ERC checks pass
If you have prior experience laying out mixed-signal audio hardware, controlled-impedance routing, or EMC mitigation, please highlight that. I am ready to share the existing schematic and connector footprints as soon as we agree to proceed.
The schematic is already in Kicad 9.0. Footprints and 3d models are in place. You will need to decide the optimal layer order, and route every net with good mixed-signal practices—quiet star ground plane, short high-speed traces, and clean separation of analogue and digital domains. When you are done I should be able to hand the files straight to a board house and receive a working board without further tweaks.
Deliverables & acceptance criteria
• Native KiCad project (schematic + PCB) that opens error-free
• Gerbers, drill files, pick-and-place, and BOM ready for JLCPCB’s 5/5 mil rules
• Board outline ≤ 200 mm × 200 mm and at least four layers with a solid ground plane
• Audio connectors correctly positioned for front-panel use
• All DRC and ERC checks pass
If you have prior experience laying out mixed-signal audio hardware, controlled-impedance routing, or EMC mitigation, please highlight that. I am ready to share the existing schematic and connector footprints as soon as we agree to proceed.