Compact PCB design based on TI EVM430-FR6043 board - 05/09/2025 03:25 EDT
Budget: ₹20,000 – ₹26,000 INR
Project Overview:
We are seeking an experienced freelance PCB designer to create a compact, minimum 4-layer PCB for an ultrasonic flow meter based on Texas Instruments' EVM430-FR6043. The board must be significantly smaller than the evaluation board by eliminating non-essential components (e.g., extra headers, unused I2C/Serial ports) while ensuring signal integrity, EMI/EMC compliance, and ESD protection. The design will use the MSP430FR6043 MCU for low-power ultrasonic sensing (1.8V–3.6V). This project focuses solely on hardware design; no firmware development is required.
Key Requirements:
PCB Design Experience: Proficiency in 4-layer PCB design using cost-effective tools like KiCad or Eagle (Altium Designer optional).
Signal Integrity & EMI/EMC: Practical knowledge of routing high-frequency signals (e.g., for ultrasonic transducers), impedance control, and basic EMI/EMC mitigation (e.g., ground planes, shielding). Experience with ESD protection (e.g., TVS diodes, grounding).
TI Hardware Familiarity: Experience with MSP430 MCUs or similar low-power systems. Familiarity with ultrasonic sensing is a plus.
Size & Cost Optimization: Ability to reduce board size and select cost-effective components while maintaining core functionality (ultrasonic AFE, transducer interfaces, power management).
General Skills:
Component selection and BOM optimization for cost and availability.
Basic design rule checks for manufacturability (e.g., IPC standards).
Ability to adapt reference designs (e.g., EVM430-FR6043 schematics).
Deliverables and Milestones:
The project is divided into two milestones with balanced effort and compensation:
Milestone 1: Schematic Design
Adapt the EVM430-FR6043 reference schematic, removing non-essential components (e.g., extra headers, unused I2C/Serial ports) to minimize footprint and cost.
Verify schematic for compatibility with the MSP430FR6043 and ultrasonic transducer interfaces.
Provide brief notes on signal integrity, EMI/EMC, and ESD considerations (e.g., planned grounding strategy, initial ESD component placement).
Deliverables: Editable schematic files (.sch) in KiCad or Eagle and brief design notes.
Timeline: 1 week.
Milestone 2: Component Selection and PCB Design
Select cost-effective, widely available components and finalize the Bill of Materials (BOM) with sourcing recommendations.
Design a compact 4-layer PCB layout (e.g., ground-signal-power-ground stackup), including Gerber and drill files, optimized for size, signal integrity, EMI/EMC, and ESD protection.
Implement high-frequency routing best practices, continuous ground planes, and ESD protection (e.g., TVS diodes).
Perform design rule checks (DRCs) for manufacturability.
Provide updated design notes summarizing signal integrity, EMI/EMC, and ESD implementation.
One revision based on feedback.
Deliverables: PCB layout files (Gerber, drill files), finalized BOM, and updated design notes.
Timeline: 1–2 weeks.
Please Submit your proposal with:
Relevant experience and portfolio showcasing 4-layer PCB designs or similar projects.
Confirmation of ability to meet the timeline (2-3 weeks)
Any questions about the project.
We look forward to collaborating with a skilled designer to deliver this cost-effective, compact ultrasonic flow meter PCB!
We are seeking an experienced freelance PCB designer to create a compact, minimum 4-layer PCB for an ultrasonic flow meter based on Texas Instruments' EVM430-FR6043. The board must be significantly smaller than the evaluation board by eliminating non-essential components (e.g., extra headers, unused I2C/Serial ports) while ensuring signal integrity, EMI/EMC compliance, and ESD protection. The design will use the MSP430FR6043 MCU for low-power ultrasonic sensing (1.8V–3.6V). This project focuses solely on hardware design; no firmware development is required.
Key Requirements:
PCB Design Experience: Proficiency in 4-layer PCB design using cost-effective tools like KiCad or Eagle (Altium Designer optional).
Signal Integrity & EMI/EMC: Practical knowledge of routing high-frequency signals (e.g., for ultrasonic transducers), impedance control, and basic EMI/EMC mitigation (e.g., ground planes, shielding). Experience with ESD protection (e.g., TVS diodes, grounding).
TI Hardware Familiarity: Experience with MSP430 MCUs or similar low-power systems. Familiarity with ultrasonic sensing is a plus.
Size & Cost Optimization: Ability to reduce board size and select cost-effective components while maintaining core functionality (ultrasonic AFE, transducer interfaces, power management).
General Skills:
Component selection and BOM optimization for cost and availability.
Basic design rule checks for manufacturability (e.g., IPC standards).
Ability to adapt reference designs (e.g., EVM430-FR6043 schematics).
Deliverables and Milestones:
The project is divided into two milestones with balanced effort and compensation:
Milestone 1: Schematic Design
Adapt the EVM430-FR6043 reference schematic, removing non-essential components (e.g., extra headers, unused I2C/Serial ports) to minimize footprint and cost.
Verify schematic for compatibility with the MSP430FR6043 and ultrasonic transducer interfaces.
Provide brief notes on signal integrity, EMI/EMC, and ESD considerations (e.g., planned grounding strategy, initial ESD component placement).
Deliverables: Editable schematic files (.sch) in KiCad or Eagle and brief design notes.
Timeline: 1 week.
Milestone 2: Component Selection and PCB Design
Select cost-effective, widely available components and finalize the Bill of Materials (BOM) with sourcing recommendations.
Design a compact 4-layer PCB layout (e.g., ground-signal-power-ground stackup), including Gerber and drill files, optimized for size, signal integrity, EMI/EMC, and ESD protection.
Implement high-frequency routing best practices, continuous ground planes, and ESD protection (e.g., TVS diodes).
Perform design rule checks (DRCs) for manufacturability.
Provide updated design notes summarizing signal integrity, EMI/EMC, and ESD implementation.
One revision based on feedback.
Deliverables: PCB layout files (Gerber, drill files), finalized BOM, and updated design notes.
Timeline: 1–2 weeks.
Please Submit your proposal with:
Relevant experience and portfolio showcasing 4-layer PCB designs or similar projects.
Confirmation of ability to meet the timeline (2-3 weeks)
Any questions about the project.
We look forward to collaborating with a skilled designer to deliver this cost-effective, compact ultrasonic flow meter PCB!