PCB Component Identification & Visual QC support for development of AI based PCB Inspection System
Budget: ₹75,000 – ₹150,000 INR
We are developing an AI-based Automated PCB Inspection System and are currently working with a large set of assembled PCBs that are already fabricated and available at the QC-ready stage. We are looking for a seasoned PCB inspection and assembly expert to perform structured technical verification and visual quality assessment of these boards.
The PCBs under review are high-reliability, multi-layer assemblies (4 to 28 layers) with dense routing and mixed component technologies (SMT + through-hole). Board sizes range from 50 × 50 mm up to 500 × 500 mm, across ~400 PCB variants.
The main help required is two-fold:
1️⃣ Component Verification Against BOM
Identify and verify every mounted component against the provided BOM
Check part number, package, footprint, polarity, and orientation
Flag missing, wrong, substituted, or suspect components
Verify markings where readable
Highlight any mismatch between footprint and populated part
2️⃣ Detailed Visual & Assembly Quality Inspection
Inspection should focus on:
Component placement accuracy and alignment
Orientation and polarity correctness
Tombstoning, skew, lift, or tilt
Solder joint quality (bridging, insufficient/excess solder, cold joints, voids where visible)
Pad / track visible defects and surface damage
Residues, contamination, or cleaning issues
Mechanical mounting and fixing quality
Visible process and assembly defects
A defect checklist aligned with IPC-A-610 / IPC-J-STD-001 acceptance criteria will be shared and should be used as the baseline reference.
Site Location: Hyderabad, Balanagar
Deliverables (PDF / Spreadsheet formats):
Annotated component verification log with designator-wise status and discrepancies
Visual QC defect report with marked images, defect class, and severity level
Photo evidence of critical findings
Suggested corrective actions or rework notes
A concise, repeatable inspection checklist/flow for in-house QC reuse
Timeline
1-2 weeks is preferred so we can decide next actions (AI dataset tagging, rework, or acceptance).
The PCBs under review are high-reliability, multi-layer assemblies (4 to 28 layers) with dense routing and mixed component technologies (SMT + through-hole). Board sizes range from 50 × 50 mm up to 500 × 500 mm, across ~400 PCB variants.
The main help required is two-fold:
1️⃣ Component Verification Against BOM
Identify and verify every mounted component against the provided BOM
Check part number, package, footprint, polarity, and orientation
Flag missing, wrong, substituted, or suspect components
Verify markings where readable
Highlight any mismatch between footprint and populated part
2️⃣ Detailed Visual & Assembly Quality Inspection
Inspection should focus on:
Component placement accuracy and alignment
Orientation and polarity correctness
Tombstoning, skew, lift, or tilt
Solder joint quality (bridging, insufficient/excess solder, cold joints, voids where visible)
Pad / track visible defects and surface damage
Residues, contamination, or cleaning issues
Mechanical mounting and fixing quality
Visible process and assembly defects
A defect checklist aligned with IPC-A-610 / IPC-J-STD-001 acceptance criteria will be shared and should be used as the baseline reference.
Site Location: Hyderabad, Balanagar
Deliverables (PDF / Spreadsheet formats):
Annotated component verification log with designator-wise status and discrepancies
Visual QC defect report with marked images, defect class, and severity level
Photo evidence of critical findings
Suggested corrective actions or rework notes
A concise, repeatable inspection checklist/flow for in-house QC reuse
Timeline
1-2 weeks is preferred so we can decide next actions (AI dataset tagging, rework, or acceptance).