Product Design Engineer (PCB + 3D Enclosure Design) for Consumer Electronics Prototype
Budget: ₹1,500 – ₹12,500 INR
We are developing a handheld consumer electronics device based on the ESP32-S3 platform. We have a verified functional prototype and a preliminary Bill of Materials (BOM).
We are seeking a versatile Electromechanical Engineer to handle the complete physical design:
Electronics: Designing a custom PCB for the main control unit.
Mechanical: Designing the 3D-printable enclosure to house the electronics and a high-capacity battery.
Key Responsibilities:
Mechanical Design (3D CAD):
Design a 2-part enclosure: A "Main" unit (housing the PCB, Display, and Sensors) and a "Base" unit (housing a large cylindrical Li-Ion battery).
Design the internal mounting strategy (screw bosses, snap-fits) and wire channels to route power cables between the two units.
Ensure precise cutouts for USB-C, SD Card, and the display window.
PCB Design (ECAD):
Create a custom shape PCB based on your own 3D enclosure constraints.
Route the schematic (ESP32-S3 module, Power Path Management, I2S Audio) on a 2-layer board.
Implement "keep-out zones" for the antenna and proper noise isolation for digital audio traces.
System Integration:
Verify the fitment of the PCB inside the enclosure using 3D interference checking before finalizing files.
Select appropriate wire-to-board connectors for the internal power harness.
Required Skills:
PCB Design: KiCad or EasyEDA (Schematic + Layout).
3D CAD: Fusion 360, SolidWorks, or Onshape (Must be able to export STEP/STL).
Prototyping: Experience designing for FDM/SLA 3D printing (tolerances, wall thickness).
Electronics: Experience with ESP32-S3 hardware, Lithium Battery Power Path circuits, and I2S Digital Audio.
Deliverables:
Manufacturing Files (PCB): Gerbers, BOM, Pick & Place files.
Manufacturing Files (3D): STL/3MF files ready for 3D printing.
Source Files: Editable KiCad/EasyEDA files AND editable 3D CAD files.
Assembly Guide: A simple rendering or diagram showing how the PCB mounts into the shell.
Project Specifics:
Core Module: Small form-factor ESP32-S3 module (Castellated mounting).
Power: Single Cell 21700 Li-Ion (Base mounted).
Peripherals: SPI TFT Display, I2S Microphone & Amplifier, Servo Motors.
Note to Applicants: We have a fully verified Pin Mapping Table and Component List ready to share with the selected candidate to speed up the electronic design process.
We are seeking a versatile Electromechanical Engineer to handle the complete physical design:
Electronics: Designing a custom PCB for the main control unit.
Mechanical: Designing the 3D-printable enclosure to house the electronics and a high-capacity battery.
Key Responsibilities:
Mechanical Design (3D CAD):
Design a 2-part enclosure: A "Main" unit (housing the PCB, Display, and Sensors) and a "Base" unit (housing a large cylindrical Li-Ion battery).
Design the internal mounting strategy (screw bosses, snap-fits) and wire channels to route power cables between the two units.
Ensure precise cutouts for USB-C, SD Card, and the display window.
PCB Design (ECAD):
Create a custom shape PCB based on your own 3D enclosure constraints.
Route the schematic (ESP32-S3 module, Power Path Management, I2S Audio) on a 2-layer board.
Implement "keep-out zones" for the antenna and proper noise isolation for digital audio traces.
System Integration:
Verify the fitment of the PCB inside the enclosure using 3D interference checking before finalizing files.
Select appropriate wire-to-board connectors for the internal power harness.
Required Skills:
PCB Design: KiCad or EasyEDA (Schematic + Layout).
3D CAD: Fusion 360, SolidWorks, or Onshape (Must be able to export STEP/STL).
Prototyping: Experience designing for FDM/SLA 3D printing (tolerances, wall thickness).
Electronics: Experience with ESP32-S3 hardware, Lithium Battery Power Path circuits, and I2S Digital Audio.
Deliverables:
Manufacturing Files (PCB): Gerbers, BOM, Pick & Place files.
Manufacturing Files (3D): STL/3MF files ready for 3D printing.
Source Files: Editable KiCad/EasyEDA files AND editable 3D CAD files.
Assembly Guide: A simple rendering or diagram showing how the PCB mounts into the shell.
Project Specifics:
Core Module: Small form-factor ESP32-S3 module (Castellated mounting).
Power: Single Cell 21700 Li-Ion (Base mounted).
Peripherals: SPI TFT Display, I2S Microphone & Amplifier, Servo Motors.
Note to Applicants: We have a fully verified Pin Mapping Table and Component List ready to share with the selected candidate to speed up the electronic design process.