Device Airflow & Noise Redesign
Budget: ₹1,500 – ₹12,500 INR
I already have a basic CAD model of a small consumer-electronics device, but the internal air path is restrictive and the fan hum is louder than I’d like. Your brief is to take those existing files, rethink the internal geometry, and deliver a cleaner flow path that moves more air while cutting audible noise. At the same time, I need the bottle-style joints and gaskets re-worked so every seal is tight and repeatable in manufacture.
What you’ll actually be doing
• Import my STEP files into your preferred package (SolidWorks, Fusion 360 or similar) and adjust ducting, vent placement and baffling for optimal laminar flow.
• Run CFD to quantify pressure drop, velocity fields and acoustic hotspots, then iterate until we hit noticeably lower impedance and dB levels.
• Red-spec the mating surfaces, O-ring grooves and any clip fits so the unit stays airtight without over-molding or excessive torque.
• Deliver updated 3D files, a brief report with before/after airflow plots plus any manufacturing notes needed for my prototype shop.
Acceptance criteria
1. Pressure drop reduced by at least 20 % at the same fan speed.
2. Overall sound pressure level lowered by ≥3 dB in free-field test.
3. Exploded CAD assembly shows finalized seals and fasteners ready for print/CNC.
If this sounds like your wheelhouse—especially if you’re comfortable blending electronics packaging with fluid dynamics—let’s get rolling.
What you’ll actually be doing
• Import my STEP files into your preferred package (SolidWorks, Fusion 360 or similar) and adjust ducting, vent placement and baffling for optimal laminar flow.
• Run CFD to quantify pressure drop, velocity fields and acoustic hotspots, then iterate until we hit noticeably lower impedance and dB levels.
• Red-spec the mating surfaces, O-ring grooves and any clip fits so the unit stays airtight without over-molding or excessive torque.
• Deliver updated 3D files, a brief report with before/after airflow plots plus any manufacturing notes needed for my prototype shop.
Acceptance criteria
1. Pressure drop reduced by at least 20 % at the same fan speed.
2. Overall sound pressure level lowered by ≥3 dB in free-field test.
3. Exploded CAD assembly shows finalized seals and fasteners ready for print/CNC.
If this sounds like your wheelhouse—especially if you’re comfortable blending electronics packaging with fluid dynamics—let’s get rolling.