Aluminum Wedge Bonding Head Design
Budget: $250 – $750 USD
I need a fresh bonding-head design optimised for semiconductor device assembly that relies exclusively on aluminum wedge bonding.
Scope
• Engineer the complete head layout—from transducer interface to wedge-tool tip—so it delivers consistent stitch bonds on standard lead-frame pads and silicon die metallisation.
• Select or specify materials, surface finishes, and tolerances that withstand ultrasonic energy yet minimise tool wear when working with 25 – 75 µm Al wire.
• Provide 3D CAD (STEP or SolidWorks native) plus dimensioned manufacturing drawings ready for CNC or EDM.
• Include a brief application note covering recommended ultrasonic settings, clamp force range, and preventative maintenance.
Acceptance
The model should mate with common 60 kHz ultrasonic transducers (e.g., Hesse, TPT, Kulicke & Soffa). Finite-element checks or hand calculations must show acceptable resonance and thermal behaviour during continuous bonding cycles.
I will supply pad geometry samples and existing machine constraints as soon as we start.
Scope
• Engineer the complete head layout—from transducer interface to wedge-tool tip—so it delivers consistent stitch bonds on standard lead-frame pads and silicon die metallisation.
• Select or specify materials, surface finishes, and tolerances that withstand ultrasonic energy yet minimise tool wear when working with 25 – 75 µm Al wire.
• Provide 3D CAD (STEP or SolidWorks native) plus dimensioned manufacturing drawings ready for CNC or EDM.
• Include a brief application note covering recommended ultrasonic settings, clamp force range, and preventative maintenance.
Acceptance
The model should mate with common 60 kHz ultrasonic transducers (e.g., Hesse, TPT, Kulicke & Soffa). Finite-element checks or hand calculations must show acceptable resonance and thermal behaviour during continuous bonding cycles.
I will supply pad geometry samples and existing machine constraints as soon as we start.
Related categories:
CAD/CAM
Solidworks
Finite Element Analysis
Manufacturing Design
Product Design
Thermal Analysis
3D CAD